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Study on the Properties of Laser Cutting Refractory Materials
The two-way laser system for differential absorption in light detection and ranging (LIDAR) emits a wavelength that resonates with the target gas, followed by an almost non-resonant wavelength almost instantly, replacing conventional dual-laser setups. This technology has two key applications in free-space optical communication. First, when data traffic is heavy, the laser rapidly switches between the two wavelengths, generating complementary data sets—where one wavelength serves as a backup or enhancement to the other. Second, during low data flow periods, the laser functions as a wavelength division multiplexer, producing two independent data streams at different wavelengths.
In the U.S., the market for ceramic components is valued at around $1 billion. However, high production costs for precision parts are limiting further growth. Traditional methods like grinding or diamond machining remain dominant, but they often cause subsurface damage due to the high mechanical strength and brittleness of ceramics. Diamond tools, which account for over 75% of the cost of processing ceramic parts, can be expensive—machines alone can cost about $1 million. While laser-based processing has been explored as an alternative, it faces challenges such as meeting surface roughness standards. Some studies have shown that even if the laser effect isn’t dramatic, certain ceramic parts experience reduced flexural strength after treatment.
Laser-assisted cutting heats the ceramic material to over 1000°C, making it softer and more ductile. A three-dimensional boron nitride tool then removes the softened layer. Experiments focused on two structural ceramics: silicon nitride, known for its strong mechanical properties, and a locally stabilized zirconia, which has a thermal expansion coefficient similar to steel, making it ideal for diesel engine components.
Laser-assisted machining produces sheet wafers under controlled conditions like laser beam intensity and focus, unlike the powdered wafers generated through grinding. Scanning electron microscopy reveals that these wafers are more uniform, elongated, and exhibit elastic deformation. This morphology highlights a fundamental difference between laser-assisted machining and traditional grinding methods. Although early research suggested limitations—such as shorter tool life at elevated temperatures—recent advancements show promise in improving efficiency and quality.