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Study on the Properties of Laser Cutting Refractory Materials
The two-way laser system for differential absorption in light detection and ranging (LIDAR) emits a wavelength that matches the absorption spectrum of a specific gas, followed by an almost non-resonant wavelength almost instantly. This approach replaces traditional dual-laser systems, offering improved efficiency and accuracy. In free-space optical communication, this technology has two key applications: when data traffic is heavy, the laser rapidly switches between two wavelengths to provide complementary data sets, with one serving as an auxiliary to the other. When data flow is lighter, the laser functions similarly to a wavelength division multiplexer, generating two independent data streams on separate wavelengths.
The U.S. market for ceramic components is estimated at around $1 billion. However, the high cost of producing precision parts limits further growth. Traditional manufacturing methods like grinding or diamond machining remain dominant, but these processes often lead to subsurface damage due to the high mechanical strength and brittleness of ceramics. Diamond tools are commonly used, accounting for over 75% of the processing cost—partly because diamond grinders can cost about $1 million each. Although laser-based processing has been explored as an alternative, it faces challenges such as meeting surface roughness standards. While the laser effect is not always significant, some treated parts show reduced flexural strength.
In laser-assisted cutting, the material is heated above 1000°C, making the ceramic more ductile. A three-dimensional boron nitride tool then removes the softened layer. Experiments have focused on two structural ceramics: silicon nitride, which exhibits typical mechanical properties of advanced ceramics, and a locally stabilized zirconia, which has a thermal expansion coefficient similar to steel, making it ideal for diesel engine components.
Laser-assisted machining produces sheet wafers under controlled conditions of laser beam and intensity, rather than the powdered wafers produced through grinding. Scanning electron microscopy reveals that these wafers are uniform, elongated, and exhibit elastic deformation. This morphology highlights a fundamental difference between laser-assisted machining and traditional grinding techniques. Although early studies suggested limitations, such as tool wear at high temperatures, recent advancements have shown promising results, indicating a shift toward more efficient and precise ceramic processing methods.