Intelligent laser cutting head for improving cutting efficiency (1)

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As a machine tool builder or part manufacturer, you must choose the level of intelligent operation of the production unit. When it comes to production, whether it is to manufacture industrial cutting machines, welding machines or gluing machines, human-computer interaction is an indispensable technology today. Today's novel ideas and the company's close collaboration with users, academics, universities, and skills training centers will create tomorrow's "technical technology."

Laser cutting has become a routine approach to a wide range of material types, sizes and shapes, and its range of applications is steadily increasing, and all applications require a high degree of flexibility in the interface between the laser and the workpiece to the machine. .

In order to meet the special needs of the end user and to take into account the flexibility of the laser machine, many types of cutting heads and nozzle bodies have been developed in recent years. Multiple sensors ensure consistent, consistent cut quality even when handling coated workpiece surfaces, and the sensor is integrated with the cutting head to increase process safety and minimize processing time.

The use of continuous rotary linear drive shafts in 3D applications requires an elongated nozzle body. These applications are becoming more and more sophisticated, so in the event of a collision of nozzle electrodes or other surfaces, the sensor control circuit must be able to handle plasma, speed and faults. The interference generated by the signal is compensated. In order to control process parameters to ensure consistent and consistent product quality, process monitoring and conditioning is now performed using microcontrollers.

A new development in laser cutting sensor technology is the speed sensor. The PS 130 process sensor was originally developed for laser perforation and is planned to control the CO2 laser perforation and cutting process along with the Lasermatic or Lasermatic Z focusing head from Precitec. This sensor system consists of a measuring device, a preamplifier and a sensor to estimate the visible spectrum and infrared spectrum emitted by the laser during the cutting process. This estimate is particularly accurate in the case of stainless steel or thick sheets, as it can be corrected immediately if an error occurs. The use of PS 130 facilitates the reduction of unacceptable or incomplete cuts.

Last year, WA Whitney installed the PS 130 into the PlateLASER system. These systems are fully capable of handling thin and thick plates in a production environment. A key element of this process is that each system's independent lens axes are able to adjust the focus position in real time in real time. The Whitney Smart Laser Controller automatically performs the above lens position adjustment and virtually any process parameter adjustment. All parameters can be set using the Material Parameter Libraries, allowing automatic perforation, auto-introduction, auto-steering and speed-sensing cutting processes to be adjusted in real time.

In the initial development phase of the system, no penetration detection method was used, because the penetration process was so fast and stable when cutting the 1-1/4" material using the PlateLASER system, so it is considered unnecessary. In the process, as long as the focus position of the lens moves down the ignition point, precise pores can be formed on the material, which minimizes the penetration time and keeps the surrounding material cool, leaving room for precision cutting. PlateLASER system perforation High speed without the need for separate nozzles, cutting heads or time-consuming pre-punching operations.

However, in order to try to achieve the ultimate thickness and / or feed rate of the cutting process and still maintain a stable production level, the system needs to be equipped with monitoring devices. Whitney developed the self-adjusting real-time process control option and used the PS 130 perforated sensor as a feedback mechanism with feedback signals based on the parameter settings of the material parameter library.

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